Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9738510 | Method and structure of MEMS PLCSP fabrication | — | 2017-08-22 |
| 9685402 | Semiconductor device and method of forming recesses in conductive layer to detect continuity for interconnect between semiconductor die and substrate | Jen-Yu Chen, Yi-Wen Huang, Ke Jung Jen | 2017-06-20 |
| 9673093 | Semiconductor device and method of making wafer level chip scale package | Ming-Che Hsieh, Baw-Ching Perng | 2017-06-06 |
| 9540232 | Method and structure of MEMS WLCSP fabrication | — | 2017-01-10 |