Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9548284 | Reduced expansion thermal compression bonding process bond head | Pramod Malatkar, Hemanth K. Dhavaleswarapu | 2017-01-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9548284 | Reduced expansion thermal compression bonding process bond head | Pramod Malatkar, Hemanth K. Dhavaleswarapu | 2017-01-17 |