JL

Jae Ung Lee

AT Amkor Technology: 1 patents #48 of 116Top 45%
Overall (2017): #387,147 of 506,227Top 80%
1
Patents 2017

Issued Patents 2017

Patent #TitleCo-InventorsDate
9809446 Semiconductor package and manufacturing method thereof Byong Jin Kim, Young Seok Kim, Wook Choi, Seung Jae Yoo, Yung Woo Lee +2 more 2017-11-07