Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9679838 | Stub minimization for assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2017-06-13 |
| 9679876 | Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2017-06-13 |