Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818682 | Laminate substrates having radial cut metallic planes | Shidong Li | 2017-11-14 |
| 9743526 | Wiring board with stacked embedded capacitors and method of making | Keiichi Hirabayashi, Yoichi Miyazawa, Brian W. Quinlan, Junji Sato | 2017-08-22 |
| 9659131 | Copper feature design for warpage control of substrates | Anson J. Call, Vijayeshwar D. Khanna, Douglas O. Powell, David J. Russell | 2017-05-23 |
| 9543253 | Method for shaping a laminate substrate | Thomas E. Lombardi, Donald A. Merte, Steven P. Ostrander, Thomas Weiss, Jiantao Zheng | 2017-01-10 |