DY

DeokKyung Yang

SC Stats Chippac: 1 patents #50 of 128Top 40%
📍 Buk-ri, KR: #1 of 1 inventorsTop 100%
Overall (2017): #440,539 of 506,227Top 90%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9748203 Integrated circuit packaging system with conductive pillars and method of manufacture thereof In Sang Yoon, SeongHun Mun, Kyunghwan KIM 2017-08-29