Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748203 | Integrated circuit packaging system with conductive pillars and method of manufacture thereof | DeokKyung Yang, SeongHun Mun, Kyunghwan KIM | 2017-08-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748203 | Integrated circuit packaging system with conductive pillars and method of manufacture thereof | DeokKyung Yang, SeongHun Mun, Kyunghwan KIM | 2017-08-29 |