SM

SeongHun Mun

SC Stats Chippac: 1 patents #50 of 128Top 40%
Overall (2017): #248,393 of 506,227Top 50%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9748203 Integrated circuit packaging system with conductive pillars and method of manufacture thereof DeokKyung Yang, In Sang Yoon, Kyunghwan KIM 2017-08-29