| 9852976 |
Semiconductor package and fabricating method thereof |
Michael Kelly, Ronald Patrick Huemoeller, Roger D. St. Amand |
2017-12-26 |
| 9818684 |
Electronic device with a plurality of redistribution structures having different respective sizes |
Michael Kelly, Ronald Patrick Huemoeller, Young Rae Kim, JiYoung Chung, Minho Chang +1 more |
2017-11-14 |
| 9812386 |
Encapsulated semiconductor package |
Ronald Patrick Huemoeller, Sukianto Rusli |
2017-11-07 |
| 9799592 |
Semicondutor device with through-silicon via-less deep wells |
Ronald Patrick Huemoeller, Michael Kelly |
2017-10-24 |
| 9704842 |
Interposer, manufacturing method thereof, semiconductor package using the same, and method for fabricating the semiconductor package |
Donghoon Lee, Dohyung Kim, Jungsoo Park, Seungchul Han, Joohyun Kim +2 more |
2017-07-11 |
| 9691635 |
Buildup dielectric layer having metallization pattern semiconductor package fabrication method |
Ronald Patrick Huemoeller, Sukianto Rusli |
2017-06-27 |
| 9653428 |
Semiconductor package and fabricating method thereof |
Michael Kelly, Ronald Patrick Huemoeller |
2017-05-16 |
| 9627353 |
Method of manufacturing a semiconductor package |
Michael Kelly, Ji Hun Lee, Won Chul Do, Doo Hyun Park, Ronald Patrick Huemoeller |
2017-04-18 |
| 9576917 |
Embedded die in panel method and structure |
Ronald Patrick Huemoeller, Curtis Zwenger, Corey Reichman |
2017-02-21 |
| 9553041 |
Semiconductor device package and manufacturing method thereof |
Michael Kelly, Ronald Patrick Huemoeller, Won Chul Do |
2017-01-24 |
| 9543242 |
Semiconductor package and fabricating method thereof |
Michael Kelly, Ronald Patrick Huemoeller, Roger D. St. Amand |
2017-01-10 |