Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741617 | Encapsulated semiconductor package and method of manufacturing thereof | Bora Baloglu, Ron Huemoeller | 2017-08-22 |
| 9730327 | Stackable via package and method | Akito Yoshida, Mahmoud Dreiza | 2017-08-08 |
| 9576917 | Embedded die in panel method and structure | Ronald Patrick Huemoeller, David Jon Hiner, Corey Reichman | 2017-02-21 |
| 9559075 | Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof | Bora Baloglu, Ron Huemoeller | 2017-01-31 |