Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741617 | Encapsulated semiconductor package and method of manufacturing thereof | Curtis Zwenger, Ron Huemoeller | 2017-08-22 |
| 9607890 | Stress relieving through-silicon vias | Ronald Patrick Huemoeller | 2017-03-28 |
| 9559075 | Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof | Curtis Zwenger, Ron Huemoeller | 2017-01-31 |