Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9741617 | Encapsulated semiconductor package and method of manufacturing thereof | Curtis Zwenger, Ron Huemoeller | 2017-08-22 | $8,642,000 |
| 9607890 | Stress relieving through-silicon vias | Ronald Patrick Huemoeller | 2017-03-28 | $11,703,000 |
| 9559075 | Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof | Curtis Zwenger, Ron Huemoeller | 2017-01-31 | $24,447,000 |