Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704842 | Interposer, manufacturing method thereof, semiconductor package using the same, and method for fabricating the semiconductor package | Donghoon Lee, Dohyung Kim, Jungsoo Park, Joohyun Kim, David Jon Hiner +2 more | 2017-07-11 |