Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735154 | Semiconductor structure having gap fill dielectric layer disposed between fins | Andy Wei, Dae Geun Yang, Xiang Hu, Mariappan Hariharaputhiran | 2017-08-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735154 | Semiconductor structure having gap fill dielectric layer disposed between fins | Andy Wei, Dae Geun Yang, Xiang Hu, Mariappan Hariharaputhiran | 2017-08-15 |