Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773766 | Semiconductor device including independent film layer for embedding and/or spacing semiconductor die | Ning Ye, Chin-Tien Chiu, Suresh Upadhyayula, Peng-Fei Fu, Zhong Lu +7 more | 2017-09-26 |
| 9704797 | Waterfall wire bonding | Zhong Lu, Fen Yu, Chin-Tien Chiu, Fuqiang Xiao | 2017-07-11 |