Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773766 | Semiconductor device including independent film layer for embedding and/or spacing semiconductor die | Ning Ye, Suresh Upadhyayula, Peng-Fei Fu, Zhong Lu, Cheeman Yu +7 more | 2017-09-26 |
| 9704797 | Waterfall wire bonding | Zhong Lu, Fen Yu, Cheeman Yu, Fuqiang Xiao | 2017-07-11 |
| 9595454 | Semiconductor device including electromagnetic absorption and shielding | Dacheng Huang, Ye Bai, Kaiyou Qian | 2017-03-14 |