Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773766 | Semiconductor device including independent film layer for embedding and/or spacing semiconductor die | Ning Ye, Chin-Tien Chiu, Suresh Upadhyayula, Peng-Fei Fu, Cheeman Yu +7 more | 2017-09-26 |
| 9704797 | Waterfall wire bonding | Fen Yu, Chin-Tien Chiu, Cheeman Yu, Fuqiang Xiao | 2017-07-11 |