Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9627338 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | See Chian Lim, Teck Tiong Tan, Yung Kuan Hsiao, Yoke Hor Phua, Bartholomew Liao | 2017-04-18 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9627338 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | See Chian Lim, Teck Tiong Tan, Yung Kuan Hsiao, Yoke Hor Phua, Bartholomew Liao | 2017-04-18 |