Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748163 | Die support for enlarging die size | Soon Wei WANG, How Kiat Liew, Francis J. Carney | 2017-08-29 |
| 9691732 | Semiconductor package with elastic coupler and related methods | Yusheng LIN, Francis J. Carney | 2017-06-27 |
| 9679878 | Embedded stacked die packages and related methods | Yusheng LIN, Francis J. Carney, Yenting Wen, Azhar Aripin | 2017-06-13 |
| 9620877 | Flexible press fit pins for semiconductor packages and related methods | Yushuang YAO, Atapol Prajuckamol | 2017-04-11 |
| 9570832 | Press-fit pin for semiconductor packages and related methods | Atapol Prajuckamol, Yusheng LIN | 2017-02-14 |