Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768091 | Method of forming an electronic package and structure | — | 2017-09-19 |
| 9679878 | Embedded stacked die packages and related methods | Yusheng LIN, Francis J. Carney, Yenting Wen, Chee Hiong CHEW | 2017-06-13 |
| 9659837 | Direct bonded copper semiconductor packages and related methods | Erik Nino Tolentino, Vemal Raja Manikam | 2017-05-23 |