Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768144 | Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate | Roawen Chen, Chung Chyung Han, Shiann-Ming Liou, Chien-Chuan Wei, Runzi Chang +2 more | 2017-09-19 |
| 9659851 | Method and apparatus for improving the reliability of a connection to a via in a substrate | Long Wang, Scott Wu | 2017-05-23 |
| 9565770 | Methods of making packages using thin Cu foil supported by carrier Cu foil | Sehat Sutardja, Hyun-Joo Shin | 2017-02-07 |