| 9852939 |
Solderable contact and passivation for semiconductor dies |
Andrew N. Sawle, Matthew P. Elwin, David Paul Jones, Martin Carroll, Ian Glenville Wagstaffe |
2017-12-26 |
| 9852940 |
Method for forming a reliable solderable contact |
Andrew N. Sawle, Matthew P. Elwin, David Paul Jones, Martin Carroll, Ian Glenville Wagstaffe |
2017-12-26 |
| 9837393 |
Semiconductor package with integrated semiconductor devices and passive component |
— |
2017-12-05 |
| 9831147 |
Packaged semiconductor device with internal electrical connections to outer contacts |
— |
2017-11-28 |
| 9824977 |
Semiconductor packages and methods of forming the same |
Andrew Roberts |
2017-11-21 |
| 9799623 |
Semiconductor package with conductive clip |
— |
2017-10-24 |
| 9769928 |
High efficiency embedding technology |
— |
2017-09-19 |
| 9741635 |
Electronic component |
— |
2017-08-22 |
| 9653370 |
Systems and methods for embedding devices in printed circuit board structures |
Andrew Roberts |
2017-05-16 |
| 9653322 |
Method for fabricating a semiconductor package |
Andrew Roberts |
2017-05-16 |
| 9642289 |
Power supply and method |
— |
2017-05-02 |
| 9633951 |
Semiconductor package including a semiconductor die having redistributed pads |
Mark Pavier, Andrew N. Sawle |
2017-04-25 |
| 9620471 |
Power semiconductor package with conductive clips |
Robert J. Clarke |
2017-04-11 |
| 9595512 |
Passive component integrated with semiconductor device in semiconductor package |
— |
2017-03-14 |
| 9559056 |
Electronic component |
— |
2017-01-31 |
| 9559047 |
Passive component as thermal capacitance and heat sink |
Milko Paolucci |
2017-01-31 |
