Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9673109 | Method for fabricating a semiconductor package with conductive carrier integrated heat spreader | Eung San Cho, Andrew N. Sawle, Daniel Cutler | 2017-06-06 |
| 9633951 | Semiconductor package including a semiconductor die having redistributed pads | Andrew N. Sawle, Martin Standing | 2017-04-25 |
| 9576887 | Semiconductor package including conductive carrier coupled power switches | Eung San Cho, Andrew N. Sawle, Daniel Cutler | 2017-02-21 |