Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852940 | Method for forming a reliable solderable contact | Martin Standing, Matthew P. Elwin, David Paul Jones, Martin Carroll, Ian Glenville Wagstaffe | 2017-12-26 |
| 9852939 | Solderable contact and passivation for semiconductor dies | Martin Standing, Matthew P. Elwin, David Paul Jones, Martin Carroll, Ian Glenville Wagstaffe | 2017-12-26 |
| 9673109 | Method for fabricating a semiconductor package with conductive carrier integrated heat spreader | Eung San Cho, Mark Pavier, Daniel Cutler | 2017-06-06 |
| 9633951 | Semiconductor package including a semiconductor die having redistributed pads | Mark Pavier, Martin Standing | 2017-04-25 |
| 9601418 | Stacked half-bridge package | Eung San Cho, Chuan Cheah | 2017-03-21 |
| 9583477 | Stacked half-bridge package | Eung San Cho, Chuan Cheah | 2017-02-28 |
| 9576887 | Semiconductor package including conductive carrier coupled power switches | Eung San Cho, Mark Pavier, Daniel Cutler | 2017-02-21 |