Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748180 | Through-body via liner deposition | Jiho Kang, James Jeong | 2017-08-29 |
| 9716066 | Interconnect structure comprising fine pitch backside metal redistribution lines combined with vias | Kevin J. Lee, James Jeong, Hsiao-Kang Chang, John Muirhead, Adwait Telang +2 more | 2017-07-25 |