Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852964 | Through-body via formation techniques | — | 2017-12-26 |
| 9721886 | Preservation of fine pitch redistribution lines | Hiten Kothari, Wayne M. Lytle | 2017-08-01 |
| 9716066 | Interconnect structure comprising fine pitch backside metal redistribution lines combined with vias | James Jeong, Hsiao-Kang Chang, John Muirhead, Adwait Telang, Puneesh Puri +2 more | 2017-07-25 |
| 9660181 | Logic chip including embedded magnetic tunnel junctions | Tahir Ghani, Joseph M. Steigerwald, John H. Epple, Yih Wang | 2017-05-23 |