Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748180 | Through-body via liner deposition | Puneesh Puri, Jiho Kang | 2017-08-29 |
| 9716066 | Interconnect structure comprising fine pitch backside metal redistribution lines combined with vias | Kevin J. Lee, Hsiao-Kang Chang, John Muirhead, Adwait Telang, Puneesh Puri +2 more | 2017-07-25 |