NH

Nicolas Heuck

Infineon Technologies Ag: 1 patents #362 of 917Top 40%
📍 Lehre, DE: #3 of 8 inventorsTop 40%
Overall (2017): #294,204 of 506,227Top 60%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9659793 Method for producing a material-bonding connection between a semiconductor chip and a metal layer Frederik Otto, Christian Steininger 2017-05-23