Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659793 | Method for producing a material-bonding connection between a semiconductor chip and a metal layer | Nicolas Heuck, Frederik Otto | 2017-05-23 |
CS
Christian Steininger
Overall (2017): #459,285 of 506,227Top 95%
1
Patents 2017