Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659793 | Method for producing a material-bonding connection between a semiconductor chip and a metal layer | Nicolas Heuck, Christian Steininger | 2017-05-23 |
FO
Frederik Otto
Overall (2017): #422,082 of 506,227Top 85%
1
Patents 2017