Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852918 | Embedding additive particles in encapsulant of electronic device | Peh Hean Teh, Jagen Krishnan, Swee Kah Lee, Poh Cheng Lim, Joachim Mahler +2 more | 2017-12-26 |
| 9817079 | Molded sensor package with an integrated magnet and method of manufacturing molded sensor packages with an integrated magnet | Choo Tian Ooi, Klaus Elian, Mohd Hirzarul Hafiz Mohd Tahir | 2017-11-14 |
| 9540539 | Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device | Swee Kah Lee, Joachim Mahler, Yik Yee Tan, Soon Lock Goh, Poh Cheng Lim +2 more | 2017-01-10 |