Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852918 | Embedding additive particles in encapsulant of electronic device | Peh Hean Teh, Jagen Krishnan, Swee Kah Lee, Joachim Mahler, Chew Theng Tai +2 more | 2017-12-26 |
| 9540539 | Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device | Swee Kah Lee, Joachim Mahler, Chew Theng Tai, Yik Yee Tan, Soon Lock Goh +2 more | 2017-01-10 |