Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9817079 | Molded sensor package with an integrated magnet and method of manufacturing molded sensor packages with an integrated magnet | Chew Theng Tai, Klaus Elian, Mohd Hirzarul Hafiz Mohd Tahir | 2017-11-14 |