Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837372 | Wafer-level die to package and die to die interconnects suspended over integrated heat sinks | Florian G. Herrault, Alexandros Margomenos, Miroslav Micovic | 2017-12-05 |
| 9825116 | Formation of high-resolution patterns inside deep cavities and applications to RF SI-embedded inductors | Florian G. Herrault | 2017-11-21 |