Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837372 | Wafer-level die to package and die to die interconnects suspended over integrated heat sinks | Florian G. Herrault, Melanie S. Yajima, Miroslav Micovic | 2017-12-05 |
| 9780014 | Simultaneous controlled depth hot embossing and active side protection during packaging and assembly of wide bandgap devices | Miroslav Micovic | 2017-10-03 |
| 9584073 | Internally matched active single-to-differential RF converter | Pan Hsuanyu, Hasan Sharifi, Igal Bilik | 2017-02-28 |
| 9553057 | E-plane probe with stepped surface profile for high-frequency | Eric M. Prophet, Miroslav Micovic | 2017-01-24 |