Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842814 | Integrated RF subsystem | Miroslav Micovic | 2017-12-12 |
| 9837372 | Wafer-level die to package and die to die interconnects suspended over integrated heat sinks | Melanie S. Yajima, Alexandros Margomenos, Miroslav Micovic | 2017-12-05 |
| 9825116 | Formation of high-resolution patterns inside deep cavities and applications to RF SI-embedded inductors | Melanie S. Yajima | 2017-11-21 |