Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9641254 | Heat dissipation approach in chip on board assembly by using stacked copper microvias | Zuowei Shen, Melanie Beauchemin, Ryohei Urata | 2017-05-02 |
KF
Kyle Fukuchi
Overall (2017): #339,354 of 506,227Top 70%
1
Patents 2017