Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9641254 | Heat dissipation approach in chip on board assembly by using stacked copper microvias | Zuowei Shen, Melanie Beauchemin, Ryohei Urata | 2017-05-02 | $16,945,000 |