Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9641254 | Heat dissipation approach in chip on board assembly by using stacked copper microvias | Zuowei Shen, Kyle Fukuchi, Ryohei Urata | 2017-05-02 |
| 9614619 | Optical transceiver having separate transmitter and receiver lenses | Zuowei Shen, Jamyuen Ko, Hong Liu, Ryohei Urata | 2017-04-04 |