Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786549 | Etch damage and ESL free dual damascene metal interconnect | Chung-Ju Lee, Tien-I Bao | 2017-10-10 |
| 9741605 | Reducing defects and improving reliability of BEOL metal fill | — | 2017-08-22 |
| 9711346 | Method to fabricate a high performance capacitor in a back end of line (BEOL) | Shesh Mani Pandey | 2017-07-18 |
| 9691654 | Methods and devices for back end of line via formation | Sohan S. Mehta, Ravi Prakash Srivastava | 2017-06-27 |
| 9613909 | Methods and devices for metal filling processes | Ravi Prakash Srivastava, Nicholas Robert STOKES | 2017-04-04 |
| 9593119 | Process for the preparation of dipeptidylpeptidase inhibitors | Sachin Srivastava, Shekhar Bhaskar Bhirud | 2017-03-14 |
| 9576894 | Integrated circuits including organic interlayer dielectric layers and methods for fabricating the same | Ravi Prakash Srivastava, Xusheng Wu, Akshey Sehgal, Teck Jung Tang | 2017-02-21 |