Issued Patents 2017
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806067 | Die-die stacking | Sven Beyer, Alexander Ebermann | 2017-10-31 |
| 9793372 | Integrated circuit including a dummy gate structure and method for the formation thereof | Elliot John Smith, Nigel Chan, Sven Beyer | 2017-10-17 |
| 9735174 | FDSOI—capacitor | Peter Baars, Hans-Peter Moll | 2017-08-15 |
| 9698179 | Capacitor structure and method of forming a capacitor structure | Elliot John Smith, Sven Beyer, Alexander Ebermann | 2017-07-04 |
| 9620589 | Integrated circuits and methods of fabrication thereof | Nicolas Sassiat, Ran Yan, Kun-Hsien Lin | 2017-04-11 |
| 9608112 | BULEX contacts in advanced FDSOI techniques | Elliot John Smith, Sven Beyer, Tom Hasche | 2017-03-28 |
| 9608003 | Integrated circuit product with bulk and SOI semiconductor devices | Peter Baars, Hans-Peter Moll | 2017-03-28 |
| 9590118 | Wafer with SOI structure having a buried insulating multilayer structure and semiconductor device structure | Elliot John Smith, Sven Beyer, Nigel Chan | 2017-03-07 |
| 9583240 | Temperature independent resistor | Stefan Flachowsky, Ralf Illgen | 2017-02-28 |
| 9553046 | E-fuse in SOI configuration | Peter Baars, Hans-Peter Moll | 2017-01-24 |