Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786587 | Semiconductor device and method for manufacturing the semiconductor device | Tatsuo Nishizawa, Shinji Tada, Yoshinari Ikeda, Eiji Mochizuki | 2017-10-10 |
| 9627342 | Electronic component and method of manufacturing electronic component | Takashi Saito, Tatsuo Nishizawa, Norihiro Nashida | 2017-04-18 |
| 9579746 | Thermocompression bonding structure and thermocompression bonding method | Eiji Mochizuki, Tatsuo Nishizawa, Shinji Tada | 2017-02-28 |