Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824950 | Semiconductor device | Kyohei Fukuda, Tatsuo Nishizawa, Yuhei NISHIDA | 2017-11-21 |
| 9786587 | Semiconductor device and method for manufacturing the semiconductor device | Tatsuo Nishizawa, Shinji Tada, Yoshito Kinoshita, Yoshinari Ikeda | 2017-10-10 |
| 9579746 | Thermocompression bonding structure and thermocompression bonding method | Yoshito Kinoshita, Tatsuo Nishizawa, Shinji Tada | 2017-02-28 |