Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786587 | Semiconductor device and method for manufacturing the semiconductor device | Tatsuo Nishizawa, Yoshito Kinoshita, Yoshinari Ikeda, Eiji Mochizuki | 2017-10-10 |
| 9579746 | Thermocompression bonding structure and thermocompression bonding method | Yoshito Kinoshita, Eiji Mochizuki, Tatsuo Nishizawa | 2017-02-28 |