Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748162 | Chip to wafer package with top electrodes and method of forming | Zhiqi Wang, Junjie Li, Qiong Yu, Wei-Chung Wang | 2017-08-29 |
| 9634710 | Electronic device and method for making same | Yu Wang, Jiang Liang, Bi-Ling Dong | 2017-04-25 |
| 9610799 | Housing for electroic device and method for making same | Yu Wang, SHUI-YING CHEN, Bi-Ling Dong | 2017-04-04 |