WW

Wei-Chung Wang

CC China Wafer Level Csp Co.: 2 patents #1 of 5Top 20%
NL National Applied Research Laboratories: 2 patents #2 of 70Top 3%
NU National Tsing Hua University: 1 patents #39 of 221Top 20%
QU Qualcomm: 1 patents #1,395 of 3,039Top 50%
Tesla: 1 patents #43 of 162Top 30%
Overall (2017): #13,090 of 506,227Top 3%
7
Patents 2017

Issued Patents 2017

Patent #TitleCo-InventorsDate
9762897 Conic section calibration object for calibrating image capturing device Chi-Hung Huang, Yung-Hsiang Chen 2017-09-12
9761744 System and method for manufacturing photovoltaic structures with a metal seed layer 2017-09-12
9748162 Chip to wafer package with top electrodes and method of forming Zhiqi Wang, Junjie Li, Ying Yang, Qiong Yu 2017-08-29
9644947 Optical interferometric apparatus for real-time full-field thickness inspection and method thereof Chi-Hung Huang, Po-Chi Sung, Meng-Hsiu Li 2017-05-09
9601531 Wafer-level packaging structure for image sensors with packaging cover dike structures corresponding to scribe line regions Zhiqi Wang, Qiong Yu 2017-03-21
9584184 Unified front-end receiver interface for accommodating incoming signals via AC-coupling or DC-coupling Miao Li, Xiaohua Kong, Jingcheng Zhuang 2017-02-28
9568302 Concentric circle adjusting apparatus for multiple image capturing device Chi-Hung Huang, Yung-Hsiang Chen 2017-02-14