Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748162 | Chip to wafer package with top electrodes and method of forming | Zhiqi Wang, Junjie Li, Ying Yang, Wei-Chung Wang | 2017-08-29 |
| 9601531 | Wafer-level packaging structure for image sensors with packaging cover dike structures corresponding to scribe line regions | Zhiqi Wang, Wei-Chung Wang | 2017-03-21 |