Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786532 | Substrate processing apparatus and method of transferring a substrate | Toshio Yokoyama, Masahiko Sekimoto, Kenichi Kobayashi, Kenichi Akazawa, Takashi Mitsuya | 2017-10-10 |
| 9633898 | Etching liquid, etching method, and method of manufacturing solder bump | Akira Susaki | 2017-04-25 |
| 9556533 | Substrate processing apparatus and substrate processing method | Tsutomu Nakada | 2017-01-31 |