Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9789689 | Method of forming through-substrate | Seiko Minami, Masataka Kato, Masaya Uyama, Toshiyasu Sakai, Hiroshi Higuchi | 2017-10-17 |
| 9676193 | Substrate processing method and method of manufacturing substrate for liquid discharge head including forming hole in substrate by dry etching | Masataka Kato, Hiroshi Higuchi, Seiko Minami, Masaya Uyama, Toshiyasu Sakai | 2017-06-13 |
| 9586400 | Liquid discharge head, liquid discharge apparatus, and method of manufacturing liquid discharge head | Masataka Kato, Toshiyasu Sakai, Takayuki Kamimura, Hiroshi Higuchi | 2017-03-07 |
| 9548207 | Method of etching a silicon substrate | Masataka Kato, Masaya Uyama | 2017-01-17 |