Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9789689 | Method of forming through-substrate | Yoshinao Ogata, Seiko Minami, Masataka Kato, Masaya Uyama, Toshiyasu Sakai | 2017-10-17 |
| 9676193 | Substrate processing method and method of manufacturing substrate for liquid discharge head including forming hole in substrate by dry etching | Masataka Kato, Yoshinao Ogata, Seiko Minami, Masaya Uyama, Toshiyasu Sakai | 2017-06-13 |
| 9586400 | Liquid discharge head, liquid discharge apparatus, and method of manufacturing liquid discharge head | Masataka Kato, Yoshinao Ogata, Toshiyasu Sakai, Takayuki Kamimura | 2017-03-07 |