Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9789689 | Method of forming through-substrate | Yoshinao Ogata, Masataka Kato, Masaya Uyama, Toshiyasu Sakai, Hiroshi Higuchi | 2017-10-17 |
| 9676193 | Substrate processing method and method of manufacturing substrate for liquid discharge head including forming hole in substrate by dry etching | Masataka Kato, Hiroshi Higuchi, Yoshinao Ogata, Masaya Uyama, Toshiyasu Sakai | 2017-06-13 |