Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9827740 | Polyimides as laser release materials for 3-D IC applications | Xiao Liu, Dongshun Bai, Xing-Fu Zhong, Qi Wu | 2017-11-28 |
| 9827757 | Methods of transferring device wafers or layers between carrier substrates and other surfaces | Jeremy McCutcheon, Susan E. Bailey | 2017-11-28 |